Capabilities

Capabilities

Whether for prototypes, low volume runs, or high volume production, our comprehensive services meet your needs.

Assembly

  • Surface Mount & Thru-hole.
  • Solder paste printing.
  • Ball grid array.
  • Aqueous cleaning.
  • Conformal coating.
  • Mechanical assembly (“box build”).

Testing and Inspection

  • X-ray inspection.
  • Automated optical inspection
  • Solder paste inspection.
  • In-circuit testing.
  • Custom fixture testing.

Turnkey Manufacturing

  • Sourcing & procurement of all BOM components.
  • Inventory management.
  • Board assembly and mechanical assembly.

Rework

  • Disassembly & component replacement.
  • BGA Rework.
  • Quick turn-arounds.

Capabilities

Whether for prototypes, low volume runs, or high volume production, our comprehensive services meet your needs.

Assembly

  • Surface Mount & Thru-hole.
  • Solder paste printing.
  • Ball grid array.
  • Aqueous cleaning.
  • Conformal coating.
  • Mechanical assembly (“box build”).

Turnkey Manufacturing

  • Sourcing & procurement of all BOM components.
  • Inventory management.
  • Board assembly and mechanical assembly.

Testing and Inspection

  • X-ray inspection.
  • Automated optical inspection
  • Solder paste inspection.
  • In-circuit testing.
  • Custom fixture testing.

Rework

  • Disassembly & component replacement.
  • BGA Rework.
  • Quick turn-arounds.

Certifications

Certified ISO 9001:2008 for low volume and prototype assembly and repair of electronics devices.

Certified ISO 9001:2008, ISO/TS 16949:2009, ISO 14001:2004 for high volume assembly of electronic devices.

IPC-A-610C Class II and Class III Workmanship.

Traceability and closed-loop work processes integrated into quality management system.      

Let Us Help You Bring Your Project to Life

From concept development, through prototyping, to full-scale production, to after-market support, we are with you.